Universal heat sink plate for mobile phones

Product name: Composite uniform heat sink plate

Product size: 60*106*28mm

Magnetic (universal magnetic models and back clip models use of heat sink, the back of the double-sided adhesive material)

How to use: put the back of the phone, with the use of heat sink, increase the heat dissipation area, so as to achieve the phone's CPU and camera cooling.

The magnetic absorbent product is embedded inside the magnetic sheet, glued seamlessly, the magnetic absorbent radiator can be directly adsorbed to use.

Specs:

Characteristic:

[Mobile phone composite uniform heat plate] fast cooling uniform heat dissipation, increase the heat dissipation area, accelerate the speed of heat dissipation.

[Semiconductor cooling and large area heat sink] for cell phone hot spots, using a large area even a heat sink, rapid heat neutralization to achieve uniform heat dissipation effect.

[Strong Adhesive: Does not fall off] Strong adhesive, firmly adsorbed, no need to worry about the radiator falling off.

[Thin and Light Experience] The thickness is only 1mm, it fits the phone perfectly.

[With silicone protection, do not hurt the phone] easy to wear and easy to paste, with silicone protection, soft and do not hurt the machine.

Package includes:

1 × Heat Sink Area Increase Board